Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same

ABSTRACT

A semiconductor device of the present invention includes a film-like flexible substrate having formed thereon a wiring pattern, external connection terminals formed at both end portions of the flexible substrate; and a semiconductor element mounted on a surface side of the flexible substrate, wherein a folded part, which is folded down in U-shape to a back surface side of the flexible substrate, is formed in a fixed state at least at one end portion of the flexible substrate. With this structure, the semiconductor device is COF mounted, and, for example, in its application to a liquid crystal module wherein the semiconductor device is provided so as to face a liquid crystal panel, the external connection terminals of the flexible substrate can be connected to an inner surface of a module main body for a liquid crystal panel in a state the semiconductor element of the semiconductor device faces the inside of the module main body. As a result, since the semiconductor element can be mounted without being projected to the outside of the module main body, the liquid crystal module can be made thinner for the thickness of the semiconductor element.

FIELD OF THE INVENTION

The present invention relates to a so-called COF (Chip-On-Film) typesemiconductor device wherein a semiconductor element is mounted on aflexible wiring substrate, a liquid crystal module wherein a liquidcrystal panel is connected to the semiconductor device and a method ofmanufacturing the liquid crystal module, and an electric componentadopting the liquid crystal module, and more particularly relates to aconnection structure of external connection terminals of thesemiconductor device. The liquid crystal module is applicable to, forexample, a portable phone, an automobile navigation equipment system, apersonal data assistant (PDA), a word processor, a personal computer,television sets, motors, etc.

BACKGROUND OF THE INVENTION

A semiconductor device of a so-called COF (Chip-On-Film) structurewherein a semiconductor element is joined to or mounted on a flexiblewiring substrate has been used in a variety of fields, and hereinafter,the semiconductor device of the COF structure is referred to as a“COF-type semiconductor device”. Typical examples for applications ofsuch COF-type semiconductor device include a liquid crystal driveradopting a semiconductor element of a liquid crystal driver integratedcircuit (IC). The liquid crystal driver adopting the COF-typesemiconductor device is structured such that one of the end portions ofa flexible wiring substrate is connected to the liquid crystal displaysubstrate for use in forming a liquid crystal panel, and the other endportion is connected to a printed wiring substrate, thereby forming aliquid crystal module.

The liquid crystal module adopting the COF-type semiconductor device canbe formed in a thinner structure and is therefore suited forcompact-size electronic equipments such as a portable telephone, apager, a game machine, etc.

However, for the liquid crystal module adopting the COF-typesemiconductor device, for example, as disclosed in Japanese Laid-OpenPatent Publication No.11-249583/1999 (Tokukaihei 11-249583, published onSep. 17, 1999), a structure wherein a flexible wiring substrate isfolded down to the back surface side of a liquid crystal panel afterconnecting the flexible wiring substrate to the liquid crystal panel isknown.

Specifically, as illustrated in FIG. 11, a display device as a liquidcrystal module 100 of the above publication includes a semiconductordevice 104 wherein a semiconductor element 103 is joined or mounted on aback surface of a flexible substrate 102 having formed thereon a wiringpattern 101.

One end portion of the flexible substrate 102 in the semiconductordevice 104 is connected to a liquid crystal panel 108 composed of anupper glass substrate 106 and a lower glass substrate 107 interposedbetween polarization plates 105. Below the lower glass substrate 107,provided is a light-directing plate 110 supported by an upper frame 109.Further, along the side face of the light-directing plate 110, an LED(Light Emitting Diode) 111 is provided as a back light.

Below the upper frame 109, a lower frame 112 is provided, and betweenthe upper frame 109 and the lower frame 112, a semiconductor element 103mounted on the surface of the flexible substrate 102 is interposed so asto face downward. Namely, the semiconductor element 103 is stored in arecessed part of the lower frame 112, and the flexible substrate 102 iscurved so as to have a cross section of substantially C-shape.

As described, the above display device has a connection part 113 formedon the upper glass substrate 106 of the liquid crystal panel 108, andthe semiconductor element 103 is mounted on the flexible substrate 102so as to be extended (projected) outward (downward in the FIG. 11).

In the foregoing liquid crystal module 100, if the connection part 113is formed on the lower glass substrate 107, the semiconductor element103 would be projected to the inside of the module main body.Conventionally, the above structure of forming the connection part 113on the lower glass substrate 107 is adopted. In this conventionalstructure, however, the number of connection points for leadingtransparent wiring formed on the upper glass substrate 106 to the lowerglass substrate 107 increases, and consequently, an area occupied by theconnection points increases. For this reason, it is difficult to realizea compact size structure for an increased number of pixels. Therefore,in recent years, the structure wherein the connection part is formed onthe upper glass substrate 106 is generally adopted for the reason thatthe number of connection points can be reduced by forming thetransparent wiring of the lower glass substrate 107 in the upper part.

As illustrated in FIG. 12, in a conventional liquid crystal module 200wherein a COF-type semiconductor device is connected to a liquid crystalpanel in flat, an electrode 203 is formed on a lower glass substrate 202of a liquid crystal panel 201. In this structure, in order to connectthe semiconductor device 210 having a semiconductor element 214 mountedon the side of a conductor pattern 212 formed or the surface of aflexible substrate 211, it is required to turn over the semiconductordevice 210 so that the semiconductor element 214 faces downward.

In this state, the semiconductor device 210 is connected to the liquidcrystal panel 210 at one end portion of the flexible substrate 211, andthe semiconductor device 210 is connected to the printed wiringsubstrate 214 at the other end portion of the flexible substrate 211.

As a result, a liquid crystal module 200 wherein the semiconductordevice 210 is connected to the liquid crystal panel 201 in flat can berealized.

However, in the conventional semiconductor device and the liquid crystalmodule adopting the conventional semiconductor device have the followingproblems.

That is, in the liquid crystal module 100 illustrated in FIG. 11, theconnection part 113 is formed on the upper glass substrate 106 of theliquid crystal panel 108. Therefore, in the structure of bending theflexible substrate 102, the semiconductor element 103 is inevitablyprojected to the outside. Consequently, a spacing for the thicknesscorresponding to the thickness of the semiconductor element 103 isrequired between the flexible substrate 102 and the main substrate 114,and a thinner structure is therefore difficult to achieved.

In the liquid crystal module 200 of the flat structure as illustrated inFIG. 12, the semiconductor element 214 is provided between the lowerglass substrate 202 of the liquid crystal panel 201 and the printedwiring substrate 214 on the side of the semiconductor device 210, andtherefore, a frame length L becomes longer.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice which realizes a liquid crystal module adopting the semiconductordevice of a thinner or shorter structure, a liquid crystal moduleadopting such semiconductor device, a method of manufacturing the liquidcrystal module, and an electronic equipment adopting the liquid crystalmodule.

In order to achieve the above object, a semiconductor device of thepresent invention is arranged so as to include:

a film-like flexible substrate having formed thereon a wiring pattern;

external connection terminals formed at both end portions of theflexible substrate; and

a semiconductor element mounted on a surface side of the flexiblesubstrate,

wherein a folded part, which is folded down in U-shape to a back surfaceside of the flexible substrate, is formed in a fixed state at least atone end portion of the flexible substrate.

In the above structure of the present invention, the semiconductordevice is COF (Chip-On-Film) mounted.

According to the foregoing structure, the folded part folded down inU-shape to the back surface of the flexible substrate is formed in afixed state at least at one end portion of the flexible substrate.Namely, the folded part is folded down to be almost in contact with theback surface, the resulting foregoing folded structure is curved sharplylike a hair pin. With this structure, it is therefore possible to formthe folded section to be thinner than, for example, a glass substrate ofa liquid crystal panel.

Therefore, as will be described later, in its application to a liquidcrystal module wherein the semiconductor device and the liquid crystalpanel are provided so as to face one another, it is possible to connectthe external connection terminals of the flexible substrate to the innersurface of a module main body in the state where the semiconductorelement of the semiconductor device is provided so as to face the insideof the module main body. As a result, it is possible to mount asemiconductor element without adopting such undesirable arrangement thatthe semiconductor element is projected to the outside of the liquidcrystal module main body can be avoided. It is therefore possible toreduce the module structure by the thickness of the semiconductorelement, thereby permitting a liquid crystal module of a thinnerstructure.

Additionally, for example, in a liquid crystal module wherein thesemiconductor device, the liquid crystal panel, and the printed wiringsubstrate are mounted in flat, a semiconductor element can be mountedwithout adopting such undesirable arrangement that the semiconductorelement is provided between the liquid crystal panel and the printedwiring substrate can be avoided.

As a result, the semiconductor device which realizes a device adoptingthe same of a thinner or shorter structure can be provided.

Additional objects, features, and strengths of the present inventionwill be made clear by the description below. Further, the advantages ofthe present invention will be evident from the following explanation inreference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 which illustrates a semiconductor device and a liquid crystalmodule in accordance with one embodiment of the present invention is across-sectional view of a liquid crystal module in which thesemiconductor device is provided so as to face a liquid crystal panel;

FIG. 2 is a cross-sectional view of a liquid crystal module withouthaving a spacer formed in a folded part;

FIGS. 3(a) and 3(b) are explanatory views for comparing a liquid crystalmodule with a conventional liquid crystal module in thickness;

FIG. 4 which illustrates a semiconductor device and a liquid crystalmodule in accordance with another embodiment the present invention is across-sectional view illustrating the liquid crystal module of suchstructure that the semiconductor device, a liquid crystal panel and aprinted wiring substrate are mounted in flat;

FIGS. 5(a) and 5(b) are explanatory views for comparing a frame of theliquid crystal module of FIG. 4 with a frame of a conventional liquidcrystal module in length;

FIGS. 6(a) through 6(e) are explanatory views illustrating the processof fixing an end portion of a film-like flexible substrate, which hasformed thereon a wiring pattern, to a spacer by folding down the endportion in substantially U-shape to a back surface side of the flexiblesubstrate after bonding the spacer to the back surface of the endportion in the process of manufacturing the liquid crystal module;

FIGS. 7(a) through 7(d) are perspective views illustrating the processesof manufacturing the liquid crystal module;

FIGS. 8(a) through 8(c) are explanatory views illustrating the processof connecting an external connection terminal of the flexible substrateto the liquid crystal panel after the manufacturing process of theliquid crystal module;

FIGS. 9(a) through 9(d) which show another method of manufacturing theliquid crystal module are explanatory views illustrating a process ofconnecting an external connection terminal of a film-like flexiblesubstrate, which has formed thereon a wiring pattern, to the liquidcrystal panel after slightly folding down the end portion to the backsurface side;

FIGS. 10(a) through 10(c) are explanatory views illustrating a processof fixing the flexible substrate to a spacer by bonding the spacer tothe back surface of an end portion of the flexible substrate after themanufacturing process of the liquid crystal module, and folding down theend portion of flexible substrate in substantially U-shape to the backsurface side;

FIG. 11 is a cross-sectional view illustrating a liquid crystal modulewherein a conventional semiconductor device and a liquid crystal panelare provided so as to face one another; and

FIG. 12 is a cross-sectional view illustrating a liquid crystal modulewherein a conventional semiconductor device, a liquid crystal panel anda printed wiring substrate are mounted in flat.

DESCRIPTION OF THE EMBODIMENTS

[First Embodiment]

The following descriptions will explain one embodiment of the presentinvention with reference to FIGS. 1 through 3(b). A liquid crystalmodule in accordance with the present invention is applicable to, forexample, a small-size electronic equipment such as a portable phone,pager, a game machine, etc.

As illustrated in FIG. 1, a liquid crystal module 1 in accordance withthe present embodiment includes a light-directing plate 11 (lightingmeans) formed above a frame 20 via a reflective sheet 11 a. Further,above the light-directing plate 11, formed via a diffusing plate 11 b isa liquid crystal panel 10 (member to be connected) comprised of an upperglass substrate 13 and a lower glass substrate 14 interposed betweenpolarization plates 12. Between the upper glass substrate 13 and thelower glass substrate 14, a liquid crystal layer (not shown) and anelectrode 15 are interposed. The upper glass substrate 13 is formedlonger than the lower glass substrate 14, and the electrode 15 ismounted on the upper glass substrate 13 so as to be exposed and extendedfacing downward. Further, an LED (Light Emitting Diode) 16 is providedas a back light (lighting means) along a side face of the lightdirecting plate 11.

The light crystal module 1 includes a semiconductor device 2 functionedas a liquid crystal driver for driving the liquid crystal panel 10. Thesemiconductor device 2 includes a flexible substrate 3 having aconductor pattern 4 (wiring pattern) formed on the surface; and asemiconductor element 6 serving as a liquid crystal driver integratedcircuit (IC: Integrated Circuit) mounted on the surface side of theflexible substrate 3. Therefore, this semiconductor device 2 is COF(Chip-on-Film) mounted.

The flexible substrate 3 is constituted by a flexible thin film tapemade of polyimide resin. Here, this flexible substrate 3 needs to bebent in a U-shape at the end portions as will be described later. It istherefore preferable to select the thickness of the flexible substrate 3to be not more than 40 μm. However, a suitable thickness of the flexiblesubstrate 3 is not limited to the above range, and may be varied to besuited for a material adopted.

The conductor pattern 4 formed on the surface of the flexible substrate3 is made of copper, and on this conductor pattern 4, a protective film5 is laminated. To the conductor pattern 4 of the flexible substrate 3,connected is the semiconductor element 6 on the side of the conductorpattern 4 via protrusion electrodes 6 a. Here, the respective connectionsurfaces of the conductor pattern 4 and the semiconductor element 6 aresealed with resin 6 b.

On the other hand, one end of the flexible substrate 3 having formedthereon the conductor pattern 4 is extended toward the liquid crystalpanel 10, and an external connection terminal 4 a formed on the endportion of the conductor pattern 4 is connected to the end portion ofthe electrode 15 formed on the upper glass substrate 13 on the liquidcrystal panel 10 by an anisotropic electrically conductive adhesiveagent. With the foregoing structure, a semiconductor element 6 of thesemiconductor device 2 in accordance with the present embodimentfunctions as a liquid crystal driver integrated circuit (IC: integratedCircuit) for driving the liquid crystal panel 10. Additionally, theconductor pattern 4 formed on the flexible substrate 3 is connected to aprinted wiring substrate (not shown) at the end portion on the oppositeside of the liquid crystal panel 10, and an electric power is obtainedfrom a power circuit, etc.

In the liquid crystal module 1 of the present embodiment, the flexiblesubstrate 3 is smoothly curved in substantially C-shape. At the endportion of the liquid crystal panel 10, a folded part 7 of substantiallyU-shape is formed so as to be folded down to the back surface side ofthe flexible substrate. Namely, the flexible substrate 3 is folded downto the opposite side of the semiconductor element 6 mounted on thesurface of the flexible substrate 3, i.e., to the back surface side ofthe flexible substrate 3. Therefore, at the end portion of the flexiblesubstrate 3, the conductor pattern 4 is formed in the upper side in theFigure, and therefore, the external connection terminal 4 a of theconductive pattern 4 facing upward is connected to the connection partof the electrode 15 formed on the upper glass substrate 13 of the liquidcrystal panel 10 so as to face downward.

As a result, the flexible substrate 3 is folded so as to surround theframe 20 provided in a standing position at the end portion of theliquid crystal module 1 so as to support the light directing plate 11and the LED 16, and the end portion of the flexible substrate 3 isformed in a U-shaped folded part 7. Therefore, the inside of the liquidcrystal module 1 as a whole has a cross-section of substantiallyS-shape.

Since the flexible substrate 3 is formed so as to have a cross-sectionof substantially S-shape, the semiconductor element 6 mounded on thesurface of the flexible substrate 3 faces the inside of the liquidcrystal module 1, and also this semiconductor element 6 can be storedwithin a spacing 20 a between the frames 20 such as a recessed sectionor an opening section. Therefore, below the flexible substrate 3, a mainsubstrate 21 is formed along the flexible substrate 3, and formation ofunnecessary spacing can therefore be avoided.

The spacing 20 a may be a recessed part or a groove formed in the frame20 but preferably be an opening formed between the frames 20 because bystoring the semiconductor element 6 within the spacing 20 a between theframes 20, the liquid crystal module 1 of a thinner structure can berealized. In the structure of FIG. 1, a single semiconductor element 6is mounted on the flexible substrate 3; however, when mounting anelectric component such as other semiconductor element 6, resistance,etc., the opening section 20 a may be formed at a correspondingposition.

In the liquid crystal module 1 in accordance with the presentembodiment, the U-shaped folded part 7 of the flexible substrate 3 isfolded at the end portion of the flexible substrate 3, and the endportion of the flexible substrate 3 is formed extremely thin. Therefore,the folded structure is, for example, thinner than the lower glasssubstrate 14 of the liquid crystal panel 10. As a result, the foldedpart 7 is formed within the thickness of the lower glass substrate 14,and thus, an increase in thickness of the liquid crystal module 1 at thecorresponding portion can be avoided.

In the U-shaped folded part 7 of the flexible substrate 3 in accordancewith the present embodiment, a spacer 22 is provided for fixing thefolded part 7, and this spacer 22 is fixed by an adhesive agent. Thespacer 22 is formed by a thin plate-like material; however, this spacer22 is not necessarily be limited to this. For example, a double-stickface tape, a thermosetting adhesive agent, a thermoplastic agent, etc.,whose thickness is ignorable, maybe adopted.

The liquid crystal module 1 is arranged such that the spacer 22 issandwiched in U-shaped folded part 7. However, the present invention isnot limited to this structure, and, for example, as illustrated in FIG.2, the structure without a spacer 22 may be adopted. The structure fromwhich the spacer 22 can be omitted can be realized, for example, byadopting a flexible substrate 3 which is easy to be bent, yet not liableto be broken. With this structure, an increase in the number ofcomponents can be prevented.

As described, the semiconductor device 2 of the present embodiment isCOF (Chin-ON-Film) mounted.

In the present embodiment, the folded part 7 folded down in U-shape tothe back surface of the flexible substrate 3 is formed in the fixedstate at least at one end portion of the flexible substrate 3. Namely,the folded part 7 is folded down to be almost in contact with the backsurface side. Therefore, the foregoing folded structure is curvedsharply like a hair pin, and as a result, it is possible to form thefolded part 7 thinner than the lower glass substrate 14 of the liquidcrystal panel 10.

Therefore, in the liquid crystal module 1 wherein the semiconductordevice 2 and the liquid crystal panel 10 are provided so as to face oneanother, the external connection terminals 4 a of the conductive pattern4 of the flexible substrate 3 can be connected to the inner surface ofthe module main body of the liquid crystal panel 10 in the state thesemiconductor element 6 of the semiconductor device 2 faces the insideof the module main body.

As a result, the liquid crystal module 1 in accordance with the presentembodiment shown in FIG. 3(a) can be made thinner for the thickness ofthe semiconductor element 6 as compared to the structure of theconventional liquid crystal module illustrated in FIG. 3(b) as thesemiconductor element 6 is not projected to the outside of the modulemain body.

As a result, the semiconductor device 2 which realizes the liquidcrystal module 1 adopting the same of a thinner structure can berealized.

The semiconductor device 2 in accordance with the present embodiment isarranged such that a spacer 22 for fixing the folded structure is formedin the inside of the U-shaped folded part 7.

Therefore, the folded structure can be maintained by the spacer 22provided in the substantially U-shape structure of the folded part 7.

As a result, the folded state remains unchanged, and the conductorpattern 4 can be prevented from being cut off, thereby realizing aquality semiconductor device 2.

The semiconductor device 2 in accordance with the present embodiment isconnected to the liquid crystal panel 10 provided on the side of thesemiconductor element 6 of the semiconductor device 2 in such a mannerthat the external connection terminals 4 a face the upper glasssubstrate 13 of the liquid crystal panel 10. Namely, for example, in thecase where the member to be connected is the liquid crystal panel 10,the semiconductor device 2 and the liquid crystal panel 10 are providedso as to face one another.

In the present embodiment, the U-shaped folded part 7 which is foldeddown to the back surface side of the flexible substrate 3 is formed atleast at the end portion on the side of the liquid crystal panel 10,i.e., one end portion of the flexible substrate 3. Therefore, by formingthe flexible substrate 3 so as to have a cross section of substantiallyS-shape within the module main body, the external connection terminals 4a can be connected to the liquid crystal panel 10 provided on the sideof the semiconductor element 6 of the semiconductor device 2 in such amanner that the external connection terminals 4 a face the upper glasssubstrate 13 of the liquid crystal panel 10.

With the foregoing structure, the semiconductor element 6 can be mountedso as to face the inside of the module main body. Therefore, in thestructure wherein the semiconductor device 2 and the liquid crystalpanel 10 are provided so as to face one another, the liquid crystalmodule adopting the semiconductor device 2 of a thinner structure can berealized.

In the semiconductor device 2 of the present embodiment, for the spacer22, a bonding tape such as a double stick face tape, or an adhesiveagent such as a thermosetting adhesive agent, etc., may be adopted.

With the above structure, the spacer 22 functions as an adhesive tape,or an adhesive agent, the folded part 7 can therefore be fixed withease.

The semiconductor device 2 in accordance with the present embodiment isarranged such that the flexible substrate 3 is made of polyimide seriesresin and the thickness thereof is selected to be not more than 40 μm.

By adopting the flexible substrate 3 made of polyimide resin inthickness of not more than 40 μm, the flexible substrate 3 can be foldedin U-shape with ease.

In the liquid crystal module 1 in accordance with the presentembodiment, one external connection terminal 4 a of the semiconductordevice 2 is connected to the liquid crystal panel 10, and the otherexternal connection terminal (not shown) is connected to the printedwiring substrate (not shown). With this structure, the liquid crystalmodule 1 can be formed by adopting the semiconductor device 2 whereinU-shaped folded sections 7 which are folded down to the back surfaceside are formed at both end portions of the flexible substrate 3 in thefixed state. As a result, the liquid crystal module 1 of a thinnerstructure can be realized.

In the liquid crystal module 1 wherein the semiconductor device 2 andthe liquid crystal panel 10 are provided so as to face one another, itis preferable that the conductor pattern 4 of the flexible substrate 3be connected to the liquid crystal panel 10 in the state where thesemiconductor element 6 of the semiconductor device 2 faces the insideof the module main body. With this structure, the liquid crystal module1 of a thinner structure can be realized.

In this regard, for the liquid crystal module 1 of the presentembodiment, since the flexible substrate 3 is provided in the inside ofthe module main body so as to have a cross section of substantiallyS-shape, it is possible to connect the semiconductor device 2 to theliquid crystal panel 10 in the above structure with ease. As a result,the liquid crystal module 1 of a thinner structure can be realized withease.

The liquid crystal module 1 of the present embodiment is arranged suchthat the light-directing plate 11 and the LED 16 are provided betweenthe liquid crystal panel 10 and the flexible substrate 3, and that thesemiconductor element 6 mounted on the flexible substrate 3 faces theinside of the module main body.

As a result, it is possible to surely reduce the thickness of the liquidcrystal module 1 provided with the light-directing plate 11 and the LED16 with ease.

[Second Embodiment]

The following will explain still another embodiment of the presentinvention in reference to FIGS. 4 through 5(b). For ease of explanation,members (structures) having the same functions as those shown in thedrawings pertaining to the first embodiment above will be given the samereference symbols, and explanation thereof will be omitted here. Itshould be noted here that respective characteristic structures of thefirst embodiment are applicable to the present embodiment.

As illustrated in FIG. 4, the liquid crystal module 30 in accordancewith the present embodiment is arranged such that the semiconductordevice 2 is connected to the liquid crystal panel 40 (member to beconnected) in flat.

Specifically, the liquid crystal panel 40 of the liquid crystal module30 is composed of an upper glass substrate 42 and a lower glasssubstrate 43 interposed between polarization plates 41. Further, betweenthe upper glass substrate 42 and the lower glass substrate 43, formedare a liquid crystal layer (not shown) and an electrode 44. The lowerglass substrate 43 is formed longer than the upper glass substrate 42,and the electrode 44 is mounted on the lower glass substrate 43 so as tobe exposed from the upper surface of the lower glass substrate 43 andface upward.

On the other hand, the semiconductor device 2 includes a semiconductorelement 6 mounted on the side of the surface of the flexible substrate3. This semiconductor element 6 functions as a liquid crystal driverintegrated circuit (IC: Integrated Circuit).

On the upper surface of the flexible substrate 3, the conductor pattern4 made of copper and the protective film 5 are laminated in this orderas in the first embodiment. At the center of the conductor pattern 4 ofthe flexible substrate 3, the semiconductor element 6 is connected toprotrusion electrodes 6 a, and the connection surface is sealed withresin 6 b.

In the flexible substrate 3 in accordance with the present embodiment,U-shaped folded parts 7 are formed at both end portions. Then, theexternal connection terminal 4 a of the conductor pattern 4 in one ofthe folded parts 7 is connected to the electrode 44 of the lower glasssubstrate 43 of the liquid crystal panel 40 by an anisotropicelectrically conductive adhesive agent. On the other hand, the externalconnection terminal 4 a of the conductor pattern 4 in the other foldedpart 7 is connected to the upper surface of the end portion of a printedwiring substrate 50 by bonding using an adhesive tape 51 below thecentral part of the flexible substrate 3.

As illustrated in FIG. 5 (a), in the described liquid crystal module 30of the present embodiment, as compared to a conventional liquid crystalmodule 200 illustrated in FIG. 5(b), the frame length L can be reducedfor the following mechanism. That is, in the conventional liquid crystalmodule 200, the lower glass substrate and the printed wiring substratefor connecting the liquid crystal panel are provided on the side wherethe semiconductor element is projected, and the printed wiring substratecannot be formed close to the lower glass substrate. Namely, it isrequired for the printed wiring substrate to have a predetermined widthfor mounting wiring or other electric components, and therefore the sizeof the printed wiring substrate cannot be reduced. Therefore, asdescribed, in the case where the semiconductor element is protrudedbetween the lower glass substrate and the printed wiring substrate, theframe length L cannot be reduced.

In the described liquid crystal module 30, the connection part of theelectrode 44 is formed on the upper surface of the lower glass substrate43; however, the present invention is not limited to this structure. Forexample, the connection part may be formed on the upper glass substrate42. In this case, it is not necessarily to form the folded part 7 in theflexible substrate 3 of the semiconductor device 2.

As described, the semiconductor device 2 adopted in the presentembodiment is COF (Chip-On-Film) mounted.

In the present embodiment, the folded parts 7 folded down in U-shape tothe back surface of the flexible substrate 3 are formed in the fixedstate at both end portions of the flexible substrate 3. Namely, therespective folded parts 7 are folded down almost in contact with theback surface. Therefore, the foregoing folded structure is curvedsharply like a hair pin.

Therefore, in the liquid crystal module 30 wherein the semiconductordevice 2, a liquid crystal panel 40 and a printed wiring substrate Soare mounted in flat; namely, these members are mounted on a plane, thesemiconductor element 6 is not formed between the liquid crystal panel40 and the printed wiring substrate 50.

As a result, as compared to the conventional liquid crystal module, thelength of the liquid crystal module 30 of the present embodiment can bereduced for the length of the semiconductor element 6. Therefore, theliquid crystal module 30 of a thinner structure can be realized.

As a result, the semiconductor device 2 which permits the liquid crystalmodule 30 adopting the semiconductor device 2 of shorter structure canbe realized.

The liquid crystal module 30 in accordance with the present embodimentis arranged such that the semiconductor device 2, the liquid crystalpanel 40 and the printed wiring substrate 50 are mounted in flat on theback surface side of the semiconductor element 6 in the semiconductordevice 2. Namely, in the state where the member to be connected is theliquid crystal panel 40, the surface of the lower glass substrate 43 ofthe liquid crystal panel 40 and the external connection terminal 4 a inthe conductor pattern 4 of the flexible substrate 3 are mounted facingdown. Additionally, the printed wiring substrate 50 is provided on theback surface side of the semiconductor element 6.

In this state, U-shaped folded sections 7 are formed in a fixed state soas to be folded down to the back surface side of the flexible substrateat both end portions of the flexible substrate. As a result, suchconnection structure that the semiconductor element 6 is provided in theupper part, and the lower glass substrate 43 of the liquid crystal panel40 and the printed wiring substrate 50 are provided in the lower partcan be achieved.

Therefore, the semiconductor element 6 is not provided between the lowerglass substrate 43 of the liquid crystal panel 40 and the printed wiringsubstrate 50. As a result, the length of the liquid crystal module 30can be reduced for the length of the semiconductor element 6.

Therefore, in the flat mounded structure of the semiconductor element 6,the liquid crystal panel 40 and the printed wiring substrate 50, thesemiconductor device 2 which permits the liquid crystal module 30adopting the semiconductor device 2 of a shorter structure can berealized.

The liquid crystal module 30 in accordance with the present embodimentis arranged such that one of the external connection terminals 4 a ofthe semiconductor device 2 is connected to the lower glass substrate 43of the liquid crystal panel 40. On the other hand, the other externalconnection terminal 4 a is connected to the printed wiring substrate 50.Therefore, the liquid crystal module 30 adopting the semiconductordevice 2 wherein the U-shaped folded parts 7 folded down to the backsurface side are formed in the fixed state at both end portions of theflexible substrate 3 can be realized. As a result, the liquid crystalmodule 30 of a shorter structure can be realized.

In the liquid crystal module 30 in accordance with the presentembodiment, the semiconductor device 2, the liquid crystal panel 40 andthe printed wiring substrate 50 are mounted in flat.

According to the structure of the present invention, since thesemiconductor device 2, the liquid crystal panel 40 and the printedwiring substrate 50 are mounted on a plane, the semiconductor device 2wherein U-shaped folded parts 7 folded down to the back surface of theflexible substrate 3 are formed in a fixed state at least at the bothend portions of the flexible substrate 3 can be connected to the liquidcrystal panel 40 without having the semiconductor element 6 between thelower glass substrate 43 of the liquid crystal panel 40 and the printedwiring substrate 50. As a result, the liquid crystal module 30 of ashorter structure can be realized.

[Third Embodiment]

The following will explain still another embodiment of the presentinvention in reference to FIGS. 6(a) through 8(c). For ease ofexplanation, members (structures) having the same functions as thoseshown in the drawings pertaining to the first embodiment will be giventhe same reference symbols, and explanation thereof will be omittedhere. It should be noted here that respective characteristic structuresof the first embodiment are applicable to the present embodiment.

In the present embodiment and also in the next fourth embodiment, in themanufacturing method of the liquid crystal modules 1 and 30, the methodof forming U-shaped folded part 7 of the semiconductor device 2 adoptedin the first and second embodiments and the method of connecting theliquid crystal panels 10 and 40 will be explained. In the presentembodiment, explanations will be given through the case wherein theU-shaped folded part 7 of the semiconductor device 2 is connected to theliquid crystal panel 40; however, the liquid crystal module 1 of thefirst embodiment may be adopted as well.

First, in the present embodiment, the process of joining the flexiblesubstrate 3 to the lower glass substrate 43 of the liquid crystal panel40 after folding the end portion of the flexible substrate 3 insubstantially U-shape when mounting the flexible substrate 3 in a statewhere the end portion is folded via the spacer 22.

As illustrated in FIG. 6(a), in the process of forming the semiconductordevice 2, the semiconductor element 6 is mounted on the flexiblesubstrate 3 having formed thereon the conductor pattern 4, and theflexible substrate 3 is then cut out in a predetermined outer shape.

Next, as illustrated in FIG. 6(b), after placing the semiconductordevice 2 so that the semiconductor element 6 faces downward, the spacer22 with the adhesive agent is pasted to the end portion on the backsurface side, and as illustrated in FIG. 6(c), the flexible substrate 3is folded by rotating the flexible substrate 3 about the corner of thespacer 22.

Next, as illustrated in FIG. 6(d), the end portion of the flexiblesubstrate 3 is mounted on a stage 61, and this end portion is depressedusing the bonding tool 62 from the surface side of the flexiblesubstrate 3, i.e., from the side the semiconductor element 6 is mounted.As a result, as illustrated in FIG. 6(e), the spacer 22 is mounted inthe inside of the U-shaped structure of the folded part 7.

The folding state of the semiconductor device 2 in the foregoingprocesses are as illustrated in the perspective views of FIGS. 7(a)through 7(d).

Next, as illustrated in FIG. 8(a), the semiconductor device 2 havingformed thereon the folded part 7 is moved closer to the electrode 15facing upward in the lower glass substrate 43 of the liquid crystalpanel 40. Further, as illustrated in FIG. 8(b), after making the stage61 contact the lower side of the substrate 2, the substrate 2 ispressurized from above with an applied heat by means of a bonding tool63, thereby connecting and fixing the electrode 15 and the conductorpattern 4 of the flexible substrate 3 by bonding using the anisotropicelectrically conductive adhesive agent.

As a result, as illustrated in FIG. 8(c), the semiconductor device 2 isconnected to the liquid crystal panel 40.

According to the foregoing manufacturing method, as illustrated in FIG.6(d), when forming the U-shaped folded part 7 in the flexible substrate3, the flexible substrate 3 is depressed by the pressurizing member 62having the spacer 22 sandwiched in between, and the U-shaped portion canbe formed smoothly by sandwiching the spacer 22. As a result, theconductor pattern 4 can be prevented from being cut off.

As described, according to the method of manufacturing the liquidcrystal module 30 of the present embodiment, first, the spacer 22 isbonded to the back surface of the end portion in the film-like flexiblesubstrate 3 having formed thereon the conductor pattern 4, and then theend portion is fixed to the spacer 22 by folding down the end portion insubstantially U-shape to the back surface of the flexible substrate 3.Thereafter, the connection process of connecting the liquid crystalpanel 40 to the conductor pattern 4 of the flexible substrate 3 isperformed.

According to the foregoing method, the U-shaped folded part 7 is fixedbeforehand by the spacer 22 in the semiconductor device 2. Therefore,when connecting the semiconductor device 2 to the liquid crystal panel40, the semiconductor device 2 and the liquid crystal panel 40 may beconnected using a generally used connection device such as a bondingtool 63, etc.

As a result, the method of manufacturing the liquid crystal modules 1and 30 of thinner or shorter structure can be realized.

[Fourth Embodiment]

The following will explain still another embodiment of the presentinvention in reference to FIGS. 9(a) through 10(c). For ease ofexplanation, members (structures) having the same functions as thoseshown in the drawings pertaining to the first through third embodimentsabove will be given the same reference symbols, and explanation thereofwill be omitted here. It should be noted here that respectivecharacteristic structures of the first through third embodiments areapplicable to the present embodiment.

In the present embodiment, when mounting the flexible substrate 3 in astate where the end portion thereof is folded via the spacer 22, afolding line is formed beforehand, and then the flexible substrate 3 isbonded to the liquid crystal panel 40. Thereafter, the spacer 22 isbonded to the end portion of the flexible substrate 3, and the endportion is then folded, thereby forming the U-shaped folded part 7.

According to the foregoing method, it is possible to fold the flexiblesubstrate 3 without having stress applied to the folded part 7 whenpressurizing the flexible substrate 3 and the liquid crystal panel 40under an applied heat.

First, as illustrated in FIG. 9(a), the semiconductor device 2 whereinthe semiconductor element 6 is mounted to the flexible substrate 3having formed thereon the conductor pattern 4 is cut out in apredetermined shape, and the semiconductor device 2 is then turned over.

Next, as illustrated in FIG. 9(b), in order to form a folding line in avicinity of the end portion of the flexible substrate 3, the flexiblesubstrate 3 is, for example, folded by around 45 degrees. Thereafter,the flexible substrate 3 is fixed to the bonding tool 63 with thesurface of the end portion of the flexible substrate 3 while maintainingthe folded structure.

Next, as illustrated in FIG. 9(c), an anisotropic electricallyconductive adhesive agent is applied to the connection part of theelectrode 15 in the liquid crystal panel 40, and then, the surface atthe end portion of the flexible substrate 3 having the folding line ismade in contact with the anisotropic electrically conductive adhesiveagent. Thereafter, the respective positioning of the electrode 15 of thelower glass substrate 32 of the liquid crystal panel 40 and theconductor pattern 4 on the flexible substrate 3 are performed.

Next, as illustrated in FIG. 9(d), the liquid crystal panel 40 ismounted on the stage 61, and by means of the bonding tool 63, theconnection part between the liquid crystal panel 40 and the flexiblesubstrate 3 is fixed using the anisotropic electrically conductiveadhesive agent by carrying out the pressurizing process under an appliedheat.

Next, as illustrated in FIG. 10 (a), the bonding tool 63 is taken out,and the spacer 22 with the adhesive agent is set to the back surface ofthe connecting section at the end portion of the flexible substrate 3,and then as illustrated in FIG. 10(b), the spacer 22 is bonded.

Next, as illustrated in FIG. 10(c), the end portion of the flexiblesubstrate 3 is folded in U-shape about the end portion of the spacer 22and is then fixed. As a result, the process of connecting the liquidcrystal panel 40 and the semiconductor device 2 is completed.

As described, in the manufacturing methods of the liquid crystal modules1 and 30 in accordance with the present embodiment, first, the endportion in the film-like flexible substrate 3 having formed thereon theconductor pattern 4 is slightly bent to the back surface side, and then,the liquid crystal panel 40 is connected to the conductor pattern 4 ofthe flexible substrate 3. Next, after bonding the spacer 22 to the backsurface of the flexible substrate 3, the process of fixing the spacer 22by folding the flexible substrate 3 down to the back surface side insubstantially U-shape is performed.

As a result, in the connection process of connecting the flexiblesubstrate 3 of the semiconductor device 2 and the liquid crystal panel40, the flexible substrate 3 can be folded without having a stressapplied to the folded part 7 when pressuring under an applied heat, andthus a problem of cutting off the conductor pattern 4 can be prevented.

As a result, the method of manufacturing the liquid crystal modules 1and 30 of thinner or shorter structure can be realized.

The semiconductor device of the present invention wherein asemiconductor element is mounted on a surface of a film-like flexiblesubstrate which has formed thereon a wiring pattern and which isprovided with external connection terminals at both end portions may bearranged such that a U-shaped folded part which is folded down to a backsurface of the flexible substrate is formed in a fixed state at least atone end portion of the flexible substrate so that the externalconnection terminals of the semiconductor device are connected to themember to be connected in such a manner that the external connectionterminals face the member to be connected.

According to the present invention, the semiconductor device is COF(Chip-ON-Film) mounted.

In the present invention, the external connection terminals areconnected to the member to be connected provided on the side of thesemiconductor element of the semiconductor device in such a manner thatthe external connection terminals face the member to be connected.Namely, for example, in the case where the member to be connected is aliquid crystal panel, the semiconductor device and the liquid crystalpanel are provided so as to face one another.

According to the foregoing structure, the U-shaped folded part which isfolded down to the back surface of the flexible substrate is formed in afixed state at least at one of the end portions of the flexiblesubstrate. Therefore, as will be described later, by providing theflexible substrate so as to have a cross section of substantiallyS-shape in the module main body, the external connection terminals canbe connected to the member to be connected provided on the side of thesemiconductor element of the semiconductor device.

In the foregoing structure, it is possible to provide the semiconductorelement so as to face the inside of the module, without providing thesemiconductor element so as to be projected to the outside.

According to the foregoing structure, in the structure wherein thesemiconductor device and the member to be connected are provided so asto face one another, a semiconductor device of a thinner structure canbe realized.

The semiconductor device of the present invention wherein asemiconductor element is mounted on a surface of a film-like flexiblesubstrate which has formed thereon a wiring pattern and which isprovided with external connection terminals at both end portions may bearranged such that U-shaped folded parts which are folded down to a backsurface of the flexible substrate are formed in a fixed state at bothend portions of the flexible substrate, so that the semiconductordevice, the member to be connected and the printed wiring substrate canbe mounted in flat on the back surface side of the semiconductor elementof the semiconductor device.

According to the present invention, the semiconductor device is COF(Chip-ON-Film) mounted.

According to the present invention, the semiconductor device, the memberto be connected and the printed wiring substrate are mounted on the backsurface side of the semiconductor element of the semiconductor device inflat. Namely, for example, in the case where the member to be connectedis a liquid crystal panel, the surface of the lower glass substrate ofthe liquid crystal panel and the wiring pattern of the flexiblesubstrate are mounted facing down. Further, the printed wiring substrateis formed on the back surface side of the semiconductor element.

According to the foregoing structure of the present invention, theU-shaped folded parts which are folded down to the back surface of theflexible substrate are formed in a fixed state at both end portions ofthe flexible substrate. Therefore, such connected structure that thesemiconductor element is provided in the upper side and the lower glasssubstrate of the liquid crystal panel and the printed wiring substrateare provided in the lower side can be achieved.

According to this structure, the semiconductor element is not providedbetween the lower glass substrate of the liquid crystal panel and theprinted wiring substrate, and thus the overall length of thesemiconductor element can be reduced for the length of the semiconductorelement.

As a result, in the structure wherein the semiconductor device, themember to be connected and the printed wiring substrate are mounted inflat, the semiconductor device of a shorter structure can be realized.

The semiconductor device of the foregoing structure may be arranged suchthat a spacer is provided within the U-shaped structure of the foldedpart for maintaining the folded structure.

According to the foregoing structure, the folded structure can be fixedby the spacer provided in the U-shaped structure of the folded part.

Therefore, the folded structure can be maintained, and thus the externalconnection terminal can be prevented from being cut off, therebyproviding a quality semiconductor device.

The semiconductor device of the foregoing structure may be arranged suchthat the spacer is an adhesive tape or an adhesive agent.

According to the foregoing structure, the spacer functions as theadhesive tape or adhesive agent, and the folded structure can be fixedwith ease.

The semiconductor device of the present invention may be arranged suchthat the flexible substrate is made of polyimide resin, and thethickness of the flexible substrate is selected to be a thickness of notmore than 40 μm.

According to the foregoing structure, when adopting the flexiblesubstrate made of polyimide series resin, by selecting the thickness tobe not more than 40 μm, it is possible to fold the flexible substrate inU-shape with ease.

The liquid crystal module of the present invention is arranged such thatone of the external connection terminals in the semiconductor device ofthe foregoing structure is connected to the liquid crystal panel as amember to be connected, while the other external connection terminal isconnected to the printed wiring substrate.

According to the foregoing structure of the liquid crystal module, oneof the external connection terminals of the semiconductor device isconnected to the liquid crystal panel (member to be connected). Further,the other external connection terminal is connected to the liquidcrystal panel (member to be connected). As a result, the liquid crystalmodule can be realized by adopting the semiconductor device in whichfolded parts which are folded down to the back surface are formed atboth end portions of the flexible substrate.

As a result, the liquid crystal module of a thinner or shorter structurecan be realized.

The liquid crystal module having the foregoing structure may be arrangedsuch that the flexible substrate is provided so as to have a crosssection of substantially S-shape in the inside of the module main body.

For example, in the liquid crystal module wherein the semiconductordevice and the liquid crystal panel are provided so as to face oneanother, in order to realize the semiconductor device of a thinnerstructure, it is preferable that the external connection terminals ofthe flexible substrate be connected to the liquid crystal panel in sucha manner that the semiconductor element of the semiconductor devicefaces the inside of the module main body.

In this regard, with the structure of the present invention, since theflexible substrate is provided so as to have a cross section ofsubstantially S-shape in the inside of the module main body, thesemiconductor device can be connected to the liquid crystal panel in theabove state with ease.

As a result, the liquid crystal module of a thinner structure can beachieved with ease.

The liquid crystal module of the present invention having the foregoingstructure may be arranged such that the lighting means is providedbetween the liquid crystal panel and the flexible substrate, and thatthe semiconductor element mounted on the flexible substrate is providedso as to face the inside of the module main body.

According to the present invention, the lighting means is providedbetween the liquid crystal panel and the flexible substrate, and thesemiconductor element mounted on the flexible substrate is provided soas to face the inside of the module main body. Thus, the thickness ofthe liquid crystal module adopting the lighting means can be surelyreduced.

The liquid crystal module of the present invention is arranged such thatthe semiconductor device, the liquid crystal panel and the printedwiring substrate are mounted in flat.

According to the foregoing structure, the semiconductor device, theliquid crystal panel and the printed wiring substrate are mounted inflat; namely, these members are mounted on a plane. Therefore, it ispossible to connect the semiconductor device having a U-shaped foldedpart, which is folded down to the back surface, formed at least at oneend portion of the flexible substrate, to the liquid crystal panelwithout having the semiconductor element between the liquid crystalpanel and the printed wiring substrate.

As a result, the liquid crystal module of a shorter structure can beachieved.

The method of manufacturing a liquid crystal module of the presentinvention is arranged so as to include the steps of:

i) after bonding a spacer to a back surface of an end portion of afilm-like flexible substrate having a wiring pattern formed on a surfacethereof, folding down the end portion to the back surface side of theflexible substrate in substantially U-shape and fixing the resultingfolded end portion to the spacer; and

ii) after the step i), connecting external connection terminals of theflexible substrate to a liquid crystal panel or a printed wiringsubstrate.

According to the foregoing manufacturing method of the presentinvention, when manufacturing the liquid crystal module, the process offixing the end portion of the film-shaped flexible substrate having thewiring pattern formed on the surface, which is folded down insubstantially U-shape to the back surface side of the flexible substrateafter fixing the spacer to the back surface of the end portion of theflexible substrate. Then, the connection process of connecting theexternal connection terminals of the flexible substrate to the liquidcrystal panel or the printed wiring substrate is performed.

In the above method, since the U-shaped folded section fixed by thespacer is formed beforehand in the semiconductor device, when connectingthe liquid crystal panel or the printed wiring substrate to thesemiconductor device, it is possible to connect the semiconductor deviceand the liquid crystal panel or the printed wiring substrate using agenerally used connection device such as a bonding tool, etc.

As a result, the manufacturing method which provides a liquid crystalmodule of a thinner or shorter structure can be achieved by preventingan increase in cost.

The method of manufacturing a liquid crystal module of the presentinvention is arranged so as to include the steps of:

i) after slightly folding down an end portion of a film-like flexiblesubstrate having formed thereon a wiring pattern to a back surface side,connecting external connection terminals of the flexible substrate tothe liquid crystal panel or the printed wiring substrate; and

ii) after the step i), fixing the end portion of the flexible substrateto a spacer by folding down the end portion in substantially U-shape tothe back surface side after bonding the spacer to the back surface ofthe end portion of the flexible substrate.

According to the foregoing manufacturing method of a liquid crystalmodule, first, after slightly folding down the end portion of thefilm-like flexible substrate having formed thereon a wiring pattern tothe back surface side, the connection process of connecting the externalconnection terminals of the flexible substrate to the liquid crystalpanel or the printed wiring substrate is performed. Then, after bondingthe spacer to the back surface of the end portion of the flexiblesubstrate, the fixing process is performed for fixing the flexiblesubstrate to the spacer by folding it down to the back surface side insubstantially U-shape.

According to the foregoing method, when connecting the flexiblesubstrate of the semiconductor device to the liquid crystal panel orprinted wiring substrate, the flexible substrate can be folded withouthaving stress applied onto the folded part when pressuring under anapplied heat. As a result, such problem that an external connectionterminal becomes disconnected can be prevented.

As a result, the manufacturing of a liquid crystal module which providesa liquid crystal module of a thinner or shorter structure while ensuringquality can be achieved.

The liquid crystal module of the present invention is arranged so as toinclude a semiconductor device wherein a semiconductor element isprovided on a surface side of a film-like flexible substrate which has awiring pattern formed on the surface thereof and which is provided withexternal connection terminals at both end portions, and a folded partwhich is folded down to a back surface side of the flexible substrate isformed in a fixed state at least at one end portion of the flexiblesubstrate; and that the semiconductor element is connected to a liquidcrystal panel in such a manner that the semiconductor element faces theliquid crystal panel (member to be connected).

According to the foregoing structure, the semiconductor element isprovided on the side of the liquid crystal panel, i.e., in the inside ofthe liquid crystal module. Therefore, it is possible to mount asemiconductor element without adopting such undesirable arrangement thatthe semiconductor element (projected part) on the flexible substrate isprojected to the outside of the liquid crystal module can be avoided,thereby realizing a liquid crystal module of a thinner structure.

The electric equipment provided with the liquid crystal module of thepresent invention is arranged so as to include a semiconductor devicewherein a semiconductor element is mounted on a surface side of afilm-like flexible substrate which has a wiring pattern formed on asurface thereof, and which is provided with external connectionterminals at both end portions, and a folded part which is folded downto a back surface side of the flexible substrate is formed in a fixedstate at least at one end portion of the flexible substrate; and thatthe semiconductor element is connected to a liquid crystal panel as amember to be connected, while the other external connection terminal isconnected to the printed wiring substrate.

According to the foregoing structure, a liquid crystal module of athinner structure can be realized, thereby achieving a compact sizeelectric equipment.

The embodiments and concrete examples of implementation discussed in theforegoing detailed explanation serve solely to illustrate the technicaldetails of the present invention, which should not be narrowlyinterpreted within the limits of such embodiments and concrete examples,but rather may be applied in many variations, provided such variationsdo not depart from the spirit of the present invention or exceed thescope of the patent claims set forth below.

1. A semiconductor device, comprising: a film-like flexible substratehaving a wiring pattern formed on a front surface thereof; externalconnection terminals formed at both end portions of said flexiblesubstrate; and a semiconductor element mounted on the front surface ofsaid flexible substrate, wherein at least one end portion of saidflexible substrate is folded almost in contact with a back surface ofsaid flexible substrate, so that a flat portion is formed at said atleast one end portion, the flat portion having the external connectionterminals.
 2. A semiconductor device, comprising: a film-like flexiblesubstrate having a wiring pattern formed on a front surface thereof;external connection terminals formed at both end portions of saidflexible substrate; and a semiconductor element mounted on the frontsurface of said flexible substrate, wherein at least one end portion ofsaid flexible substrate is folded almost in contact with a back surfaceof said flexible substrate, so that a flat portion is formed at said atleast one end portion, and the flat portion has the external connectionterminals which are connectible to a member to be connected providedover the front surface of said flexible substrate.
 3. A semiconductordevice, comprising: a film-like flexible substrate having a wiringpattern formed on a front surface thereof; external connection terminalsformed at both end portions of said flexible substrate; and asemiconductor element mounted on the front surface of said flexiblesubstrate, wherein both end portions of said flexible substrate arefolded almost in contact with a back surface of said flexible substrate,so that flat portions are formed at the respective end portions, each ofthe flat portions having the external connection terminals, and theexternal connection terminals at one flat portion are connected to amember to be connected provided below said flexible substrate, while theexternal connection terminals at the other flat portion are connected toa printed wiring substrate below said flexible substrate.
 4. Thesemiconductor device as set forth in claim 1, further comprising: aspacer for fixing the flat portion to the back surface of said flexiblesubstrate.
 5. A semiconductor device, comprising: a wiring patternformed on a front surface of a film-like flexible substrate; and asemiconductor element and external connection terminals which areconnected to the wiring pattern, wherein at least one end portion ofsaid flexible substrate is folded almost in contact with a back surfaceof said flexible substrate, so that a flat portion is formed at said atleast one end portion, the flat portion having the external connectionterminals.
 6. A semiconductor device comprising: a wiring pattern formedon a film-like flexible substrate; a semiconductor element and anexternal connection terminal being provided on a front surface of thefilm-like flexible substrate and electrically connected by the wiringpattern; the external connection terminal being provided at an endportion of the film-like flexible substrate, the end portion of thefilm-like flexible substrate at which the external connection terminalis situated being folded back toward a back surface of the film-likeflexible substrate and almost in contact with the back surface so thatthe external connection terminal has an orientation for contact with anelectrode of a liquid crystal display substrate.
 7. The semiconductordevice as set forth in claim 1, wherein in the end portion, only theflat portion has the external connection terminals.
 8. The semiconductordevice as set forth in claim 4, wherein: said spacer is an adhesive tapeor an adhesive agent.
 9. The semiconductor device as set forth in claim1, wherein: said flexible substrate is made of polyimide series resin,and is formed in thickness of not more than 40 μm.